Prior to the innovation, the company’s NAND topped out at 176-layers.The new NAND is also 50% faster than Micron’s 176-layer offering, at a top speed of 2.4 gigabytes per second, while featuring100%higher write bandwidth and75%higher read bandwidth.The company also says that the 232-layer NAND has 1 terabyte per die,the highest areal density in the industry, and has heightened capacity and energy efficiency over previous Micron NANDs.“Micron’s 232-layer NAND is a watershed moment for storage innovation as first proof of the capability to scale 3D NAND to more than 200 layers in production,” said Scott DeBoer in the company’s press release. DeBoer is Micron’s executive vice president of technology and products. Speaking to Techradar Pro in 2020, Micron CEO Thomas Isakovich spoke promisingly about what this kind of NAND density can achieve, saying “We can do 200 TB in2021and likely 400 TB by 2023, depending on the timing of NAND density gains.”
CHUCKYSCARNAGE 